Global Standard For Soldering Irons
Japan Bonkote Co.Ltd
LA SOLDERING IRON
Accurate Temperature Control under Load
LA ＝ Load Application temperature control method
（LA type）
LA type soldering iron units can control accurate tip temperature in soldering.
A temperature sensor is installed near the working point on the tip surface of the iron tip, making it possible to accurately monitor temperature changes. You can work while checking the actual temperature during soldering, and you can quickly return to standby temperature. LA soldering iron can improve quality and reduce costs.
V-CUT SOLDER MACHINE
Solder wire V-groove processing device BON-8116/8216
The adjuster lever makes it easy to change the wire diameter! It also comes with wire diameter points.
Prevents solder balls from scattering!
Solder wire V groove processing device
For thick wire
■ Solder wire diameters from Φ1.0 to Φ1.6 can be handled with one machine
■ Adjuster lever makes it easy to change wire diameter!
■ No replacement parts required
Lead-free soldering and high-density mounting mean that the tip temperature has to be raised. When solder touches the tip, the flux, which has a low melting point, will bump and cause solder balls and flux to scatter. This can adhere to the leads of electronic components and cause short circuits. These problems can be prevented by making a V-groove in the solder wire before soldering.
Solder wire V-groove processing device BON-8116/8216
Lead-free soldering and high-density mounting mean that the tip temperature has to be raised. When solder touches the tip, the flux, which has a low melting point, will bump and cause solder balls and flux to scatter. This can adhere to the leads of electronic components and cause short circuits. These problems can be prevented by making a V-groove in the solder wire before soldering.
Lead-free soldering and high-density mounting mean that the tip temperature has to be raised. When solder touches the tip, the flux, which has a low melting point, will bump and cause solder balls and flux to scatter. This can adhere to the leads of electronic components and cause short circuits. These problems can be prevented by making a V-groove in the solder wire before soldering.
Lead-free soldering and high-density mounting mean that the tip temperature has to be raised. When solder touches the tip, the flux, which has a low melting point, will bump and cause solder balls and flux to scatter. This can adhere to the leads of electronic components and cause short circuits. These problems can be prevented by making a V-groove in the solder wire before soldering.
PRODUCT
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